Double station IC, flex board solder joint detector
Details
1. Device function description | |||
The equipment is mainly inspected for IC/solder joint short circuit and tin deficiency. | |||
2. Equipment indicators | |||
project | Metrics and Content | Remark | |
The size of the product to be tested | Maximum test object size | L=100mm , W=30mm | |
Minimum test object size | / | ||
System Configuration | Camera model | 500W(2594*1940 ), color |