Automated Optical Inspector

Device Testing

Employing a self-developed digital image feature classification and recognition algorithm based on machine learning strategies, this approach fully leverages the color, texture, and statistical information of digital images, resulting in higher detection accuracy. It can identify devices with colored markings—features that remain undetectable using grayscale algorithms—as well as detect common defects such as missing components, misalignments, flips, side placements, damage, incorrect devices, and improper polarity.

Solder Pad Inspection

By using scientifically arranged colored light sources, distinct differences are created in the images of insufficient solder, normal solder, and excessive solder, which are then accurately identified through feature-based classification and recognition algorithms applied to digital images. This method also requires lower precision for component placement, making it suitable for detecting circuit boards with relatively low patching accuracy.

IC Solder Joint Inspection

The independently developed solder-pin recognition algorithm can automatically identify IC solder pins and seamlessly learn various image features specific to them. It delivers highly sensitive detection accuracy even for bridged solder joints, while also requiring relatively low precision in terms of the IC component's positioning—making it capable of reliably inspecting manually placed IC devices.

Precise measurement

After metrological certification, it can measure the basic dimensions of the tested workpiece: such as slot and hole widths, areas, and line thicknesses.

Product Features

Exceptionally high value for money

Fully independent intellectual property rights significantly enhance cost-effectiveness, allowing your production line to gain AOI inspection capabilities with minimal investment—ultimately helping you elevate product quality in an increasingly competitive lead-free soldering era.

Multi-standard comparison method (replacement part functionality)

The replacement parts feature prevents false alarms by setting multiple reference criteria, ensuring accurate detection even when customers use multiple batches of components or identical-model components with different appearances from various manufacturers.

Powerful automatic learning feature

Various specifications and types of components can be easily learned simply by outlining their contours—no additional special processing is required. The SRT-VT-100E AOI software automatically handles tasks such as feature extraction and algorithm optimization tailored to each component type. Whether it’s soldering learning for resistors and capacitors or IC lead learning, the process is fully automated, making it incredibly convenient and fast. Typically, programming time is less than 0.5 hours.

Suitable for multi-station production lines, offering convenient and flexible configuration.

High-speed, high-precision inspection applicable to machines used after solder paste printing, component placement, and reflow soldering.

Lead-based process / Lead-free process

Solder joints made with lead-based versus lead-free solder exhibit different levels of reflectivity and flowability, allowing for the establishment of distinct inspection standards tailored to their unique characteristics—and ultimately leading to more accurate detection results.

A concise multilingual system

Currently, the product supports Chinese and English, with plans to add support for other major languages in future releases. The Chinese version features fully Chinese menus and prompts, as well as user profiles entirely in Chinese. It also retains the familiar Windows-style click-and-drag interface, making it especially easy for domestic operators and programmers. Typically, training for operators takes no more than 1.0 hour, while programming staff usually require no more than 0.5 day of instruction.

Simple production environment requirements

It only requires the XY coordinates of the components and the bill of materials (BOM) for the circuit board to enable automatic learning—no need to build or maintain a dedicated component library, footprint library, or invest in complex conversion software. This makes it well-suited for China's challenging production environments. Additionally, the standard circuit boards used for training are fault-tolerant, ensuring that programming accuracy remains unaffected.

Intelligent learning process

The system can not only automatically acquire parameters such as the positions of IC pins but also dynamically adjust the parameter specificity of the programming template, ensuring that test data becomes more universally applicable. This reduces misjudgments and delivers exceptionally high detection accuracy—plus, it simplifies the programming process.

Technical data

Product Technical Features

1. Pick-and-Place Machine Data Import Function

The data from the pick-and-place machine can be used to automatically generate programming data, significantly boosting programming speed.

2. Library Component Functions

Powerful, well-equipped library components and automated calls to similar component programming methods enhance coding speed and standardize programming data.

3. Multi-threading Technology

Fully leverage the performance advantages of computers to enhance testing speed.

4. Asynchronous Manual Verification Process

Operators’ assessments are conducted simultaneously with machine testing, allowing them to review the test results of the first 20 boards—and when combined with the automatic front-to-back detection feature, this significantly boosts inspection speed.

5. Select any MARK point as needed

In addition to using traditional circular, rectangular, cross-shaped, and triangular markers as MARK points, you can also employ any distinctive-shaped marker as a MARK point. Up to three backup MARK points can be selected to ensure precise positioning of the circuit board.

6. Robust detection capability for photoresist materials

Powerful automatic adjustment features allow even highly sensitive dark-field resistors to be handled effortlessly, with no need to adjust the lighting.

7. Discrete Component Color Ring Test

The industry's most reliable color-code component testing technology, which automatically eliminates the influence of ambient light to accurately extract color-code color information for testing.

8. Arbitrary-angle measurement method

All components, solder joints, solder, and bridging tests can be performed at any angle.

9. Automatic Path Optimization

The camera's walking path has been optimized using intelligent machine learning methods, ensuring the camera performs tests in the shortest and fastest possible route.

10. Automatic Segmentation of IC Pins and Discrete Component Leads

Patented technology automatically segments IC pins and discrete component leads, while also enabling automatic configuration of test parameters for each pin. This eliminates the tedious process of individually programming solder volume and short-circuit window settings for each pin, resulting in programming speeds that are more than 5 times faster than those of competitors.

11. Multi-criteria comparison method

The replacement parts feature prevents false alarms by setting multiple reference criteria, ensuring accurate detection even when customers use multiple batches of components or identical-model components with different appearances from various manufacturers.

12. Robust wave soldering inspection capability

The industry's strongest wave soldering inspection capability—fast-paced and capable of detecting even the tiniest through-hole defects.

13. Powerful barcode recognition feature

It can automatically recognize 1D and 2D barcodes, and the barcode size is not limited by the field of view—providing customers with robust technical support for seamless quality traceability, making it both practical and intuitively convenient.

14. Comprehensive SPC Statistical Functions

Complete industrial process control enables the export of statistical data, providing data support for the continuous improvement of production line quality.

15. Unique Intelligent Weight Analysis Method

Featuring a proprietary patented algorithm and robust fault-tolerance capabilities, this system requires only a few boards for stable testing, delivering exceptionally low rates of false positives and missed detections. Plus, with no need for complex parameter adjustments, it ensures that every operator can easily handle the process.

16. Patent-protected cardboard structure effortlessly handles borderless circuit boards

Automatic clamping pallet structure for convenient handling of circuit boards; the distance between circuit board components and the board edge can be as low as zero while still ensuring effortless operation—no additional fixtures or support plates required.

17. Automatic Duplex Function

The automatic duplex feature makes double-sided testing quick and effortless.

18. Full-Route Navigation Feature

Intuitive, comprehensive, and clearly designed end-to-end navigation system software has dramatically simplified the way programs are created, making programming no longer tedious or challenging.

19. Unique size measurement feature

Expand beyond the original AOI testing capabilities to maximize the tool's potential. Accurately measure aperture sizes, groove dimensions, and areas of irregular shapes on PCB boards.

20. Customized Testing Solutions Tailored Specifically for You

Tailor-made visual inspection solutions for your products, backed by robust R&D capabilities—let us help you find the ideal testing solution that perfectly fits your product line and effectively addresses the challenges you face in product inspection.