Star River Circuit Board Optical Inspection Equipment Solves Challenges in Defective Material Removal and Tin Bead Detection


  Solder spatter and tin beads are common defects in PCBA production, significantly impacting product quality. Our company’s AOI algorithm employs a comprehensive detection method that combines image comparison with advanced image features, effectively resolving the trade-off between true defect detection and false alarms. This approach ensures accurate identification of foreign objects at any (visible) location across the entire board, while keeping the misclassification rate for "multiple defects" below 0.1%. As a result, this technology is now recognized as being at an internationally advanced level.

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